BSS84AKMB,315

Specifications

Svhc

Yes

Maximum Power Dissipation Mw

715

Ambalaj

Tape & Reel (TR)

Typical Fall Time Ns

25

Hts

8541.29.00.95

Number Of Elements Per Chip

1

Çalışma Sıcaklığı

-55°C~150°C TJ

Typical Rise Time Ns

11

Ppap

Unknown

Fet Type

P-Channel

Maximum Drain Source Resistance Mohm

7500@10V

Fabrika Tedarik Süresi

8 Weeks

Maximum Gate Source Voltage V

20

Mounting

Surface Mount

JESD-609 Kodu

e3

Yayın Yılı

2012

Contact Plating

Tin

Element Configuration

Single

Vgsth Max Id

2.1V @ 250μA

Number Of Elements

1

Maximum Drain Source Voltage V

50

Package Width

0.6

Maximum Gate Source Leakage Current Na

10000

Typical Gate Charge Vgs Nc

0.26@5V

Channel Type

P

Input Capacitance Ciss Max Vds

36pF @ 25V

Minimum Operating Temperature C

-55

Drive Voltage Max Rds On Min Rds On

10V

Process Technology

TMOS

Current Continuous Drain Id25

230mA Ta

Continuous Drain Current Id

230mA

Pin Sayısı

3

Supplier Package

DFN-B

Maximum Continuous Drain Current A

0.23

Power Dissipation Max

360mW Ta 2.7W Tc

Maximum Gate Threshold Voltage V

2.1

Typical Input Capacitance Vds Pf

24@25V

Power Dissipation

715mW

RoHS Durumu

ROHS3 Compliant

Kılıf / Paket

3-XFDFN