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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Maximum Self Height
- 1.8mm
- Connecting Mode
- Flip-lid type
- Pin Sayısı
- 6
- Card Type
- MicroSIM卡
- Height From Mounting Surface Mm
- 1.8
- Soldering Temp Max
- 260°C
- Overall Dimension
- W16.3XD14.66XH1.8
- Contact Materials
- Copper alloys
- Conntact Coatings
- Gold plated
- Weight
- 0.949
- Parça Durumu
- Active
- Package Specifications
- SMD
- Name
- #REF!
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