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C3 ChipZentronix
XCZU6CG-L1FFVC900I

Xilinx Inc.

XCZU6CG-L1FFVC900I

SoC

In StockRoHS: Compliant

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Genuine parts

Verified sourcing

RoHS

Compliant

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Technical team support

Specifications

Supply Voltagemin Vsup
0.698V
Yayın Yılı
2016
Upsucsperipheral Ics Type
MICROPROCESSOR CIRCUIT
Terminal Sayısı
900
Number Of Ios
204
Jesd30 Code
R-PBGA-B900
Yüzey Montaj
YES
Terminal Formu
BALL
Kılıf / Paket
900-BBGA, FCBGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
HTS Kodu
8542.31.00.01
Besleme Gerilimi
0.72V
Seri
Zynq® UltraScale+™ MPSoC CG
Ambalaj
Tray
RoHS Durumu
ROHS3 Compliant
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Fabrika Tedarik Süresi
11 Weeks
Speed
500MHz, 1.2GHz
Peripherals
DMA, WDT
Ram Size
256KB
Parça Durumu
Active
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Supply Voltagemax Vsup
0.742V
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Çalışma Sıcaklığı
-40°C~100°C TJ
Terminal Pozisyonu
BOTTOM
Nem Hassasiyeti (MSL)
4 (72 Hours)
Architecture
MCU, FPGA

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