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C3 ChipZentronix

Xilinx Inc.

XCZU4EG-L1FBVB900I

SoC

RoHS: Compliant

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Specifications

Yüzey Montaj
YES
Primary Attributes
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Jesd30 Code
R-PBGA-B900
Supply Voltagemax Vsup
0.742V
Supply Voltagemin Vsup
0.698V
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Besleme Gerilimi
0.72V
Terminal Sayısı
900
Terminal Formu
BALL
RoHS Durumu
ROHS3 Compliant
Kılıf / Paket
900-BBGA, FCBGA
Yayın Yılı
2016
Seri
Zynq® UltraScale+™ MPSoC EG
Number Of Ios
204
Fabrika Tedarik Süresi
11 Weeks
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Parça Durumu
Active
Çalışma Sıcaklığı
-40°C~100°C TJ
Ram Size
256KB
Architecture
MCU, FPGA
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Speed
500MHz, 600MHz, 1.2GHz
Upsucsperipheral Ics Type
MICROPROCESSOR CIRCUIT
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Ambalaj
Tray
Nem Hassasiyeti (MSL)
4 (72 Hours)
HTS Kodu
8542.31.00.01
Terminal Pozisyonu
BOTTOM

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