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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Primary Attributes
- Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
- Yüzey Montaj
- YES
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Besleme Gerilimi
- 0.85V
- Terminal Sayısı
- 900
- Jesd30 Code
- R-PBGA-B900
- Supply Voltagemax Vsup
- 0.876V
- Supply Voltagemin Vsup
- 0.825V
- RoHS Durumu
- ROHS3 Compliant
- Kılıf / Paket
- 900-BBGA, FCBGA
- Terminal Formu
- BALL
- Number Of Ios
- 204
- Yayın Yılı
- 2016
- Seri
- Zynq® UltraScale+™ MPSoC CG
- Ram Size
- 256KB
- Fabrika Tedarik Süresi
- 11 Weeks
- Parça Durumu
- Active
- Çalışma Sıcaklığı
- -40°C~100°C TJ
- Core Processor
- Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Architecture
- MCU, FPGA
- Speed
- 533MHz, 1.3GHz
- Upsucsperipheral Ics Type
- MICROPROCESSOR CIRCUIT
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Peripherals
- DMA, WDT
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Terminal Pozisyonu
- BOTTOM
- HTS Kodu
- 8542.31.00.01
- Ambalaj
- Tray
- Nem Hassasiyeti (MSL)
- 4 (72 Hours)