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C3 ChipZentronix

Xilinx Inc.

XCZU17EG-1FFVB1517I

SoC

In StockRoHS: Compliant

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Specifications

RoHS Durumu
ROHS3 Compliant
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Architecture
MCU, FPGA
Nem Hassasiyeti (MSL)
4 (72 Hours)
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Seri
Zynq® UltraScale+™ MPSoC EG
Ambalaj
Tray
Primary Attributes
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
HTS Kodu
8542.31.00.01
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Çalışma Sıcaklığı
-40°C~100°C TJ
Kılıf / Paket
1517-BBGA, FCBGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Parça Durumu
Active
Ram Size
256KB
Yayın Yılı
2016
Number Of Ios
644
Peripherals
DMA, WDT
Speed
500MHz, 600MHz, 1.2GHz
Fabrika Tedarik Süresi
11 Weeks

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