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C3 ChipZentronix
XCVU190-2FLGA2577E

Xilinx Inc.

XCVU190-2FLGA2577E

FPGAs

RoHS: Compliant

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RoHS

Compliant

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Specifications

Terminal Formu
BALL
Number Of Clbs
1800
Contact Plating
Copper, Silver, Tin
Kılıf / Paket
2577-BBGA, FCBGA
Total Ram Bits
150937600
Montaj Tipi
Surface Mount
Organization
1800 CLBS
Number Of Logic Elementscells
2349900
Number Of Ios
448
Terminal Pozisyonu
BOTTOM
Terminal Kaplaması
Tin/Silver/Copper (Sn/Ag/Cu)
Operating Supply Voltage
950mV
REACH Uyumluluk Kodu
not_compliant
Besleme Gerilimi
0.95V
JESD-609 Kodu
e1
Number Of Labsclbs
134280
Besleme Gerilimi
0.922V~0.979V
ECCN Kodu
3A001.A.7.B
Terminal Adımı
1mm
Maks. Oturma Yüksekliği
4.01mm
Yayın Yılı
2013
Fabrika Tedarik Süresi
10 Weeks
Montaj
Surface Mount
RoHS Durumu
ROHS3 Compliant
Number Of Registers
2.14848e+06
Nem Hassasiyeti (MSL)
4 (72 Hours)
Seri
Virtex® UltraScale™
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Ram Size
16.6MB
Çalışma Sıcaklığı
0°C~100°C TJ
Parça Durumu
Active
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Ambalaj
Tray
Speed Grade
2

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