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C3 ChipZentronix

Xilinx Inc.

XCVU13P-2FLGA2577I

FPGAs

RoHS: Compliant

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Specifications

Fabrika Tedarik Süresi
11 Weeks
Ambalaj
Tray
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Besleme Gerilimi
0.825V~0.876V
Number Of Labsclbs
216000
REACH Uyumluluk Kodu
not_compliant
HTS Kodu
8542.39.00.01
Parça Durumu
Active
Çalışma Sıcaklığı
-40°C~100°C TJ
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number Of Ios
448
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Number Of Logic Elementscells
3780000
Total Ram Bits
514867200
Montaj Tipi
Surface Mount
Seri
Virtex® UltraScale+™
Kılıf / Paket
2577-BBGA, FCBGA
Nem Hassasiyeti (MSL)
4 (72 Hours)
RoHS Durumu
ROHS3 Compliant

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