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C3 ChipZentronix

Xilinx Inc.

XCVU13P-2FLGA2577E

FPGAs

RoHS: Compliant

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RoHS

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Specifications

RoHS Durumu
ROHS3 Compliant
Nem Hassasiyeti (MSL)
4 (72 Hours)
Kılıf / Paket
2577-BBGA, FCBGA
Total Ram Bits
514867200
Montaj Tipi
Surface Mount
Seri
Virtex® UltraScale+™
Number Of Logic Elementscells
3780000
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Terminal Kaplaması
Tin/Silver/Copper (Sn/Ag/Cu)
Number Of Ios
448
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Ram Size
11.8MB
Çalışma Sıcaklığı
0°C~100°C TJ
Parça Durumu
Active
HTS Kodu
8542.39.00.01
REACH Uyumluluk Kodu
not_compliant
JESD-609 Kodu
e1
Number Of Labsclbs
216000
Besleme Gerilimi
0.825V~0.876V
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Ambalaj
Tray
Fabrika Tedarik Süresi
11 Weeks

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