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C3 ChipZentronix
XCVU125-2FLVB2104E

Xilinx Inc.

XCVU125-2FLVB2104E

FPGAs

RoHS: Compliant

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Specifications

Montaj
Surface Mount
Yayın Yılı
2012
Fabrika Tedarik Süresi
10 Weeks
ECCN Kodu
3A001.A.7.B
Besleme Gerilimi
0.922V~0.979V
Number Of Labsclbs
89520
JESD-609 Kodu
e1
Besleme Gerilimi
0.95V
Terminal Kaplaması
Tin/Silver/Copper (Sn/Ag/Cu)
Number Of Ios
702
Terminal Pozisyonu
BOTTOM
Number Of Logic Elementscells
1566600
Montaj Tipi
Surface Mount
Total Ram Bits
90726400
Kılıf / Paket
2104-BBGA, FCBGA
Terminal Formu
BALL
Speed Grade
2
Ambalaj
Bulk
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Ram Size
11.1MB
Çalışma Sıcaklığı
0°C~100°C TJ
Parça Durumu
Active
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Seri
Virtex® UltraScale™
Kurşunsuz
Lead Free
Nem Hassasiyeti (MSL)
4 (72 Hours)
Number Of Registers
1.43232e+06
RoHS Durumu
ROHS3 Compliant

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