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C3 ChipZentronix

Xilinx Inc.

XCVU095-2FFVB1760E

FPGAs

RoHS: Compliant

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RoHS

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Specifications

Number Of Ios
702
Terminal Pozisyonu
BOTTOM
Terminal Kaplaması
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Kodu
8542.39.00.01
Besleme Gerilimi
0.95V
Terminal Formu
BALL
Uzunluk
42.5mm
Number Of Clbs
768
Kılıf / Paket
1760-BBGA, FCBGA
Genişlik
42.5mm
Montaj Tipi
Surface Mount
Total Ram Bits
62259200
Organization
768 CLBS
Number Of Logic Elementscells
1176000
Maks. Oturma Yüksekliği
3.81mm
Terminal Adımı
1mm
Fabrika Tedarik Süresi
10 Weeks
Yayın Yılı
2012
JESD-609 Kodu
e1
Number Of Labsclbs
67200
Besleme Gerilimi
0.922V~0.979V
ECCN Kodu
3A001.A.7.B
Jesd30 Code
S-PBGA-B1760
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Parça Durumu
Active
Çalışma Sıcaklığı
0°C~100°C TJ
RoHS Durumu
ROHS3 Compliant
Nem Hassasiyeti (MSL)
4 (72 Hours)
Seri
Virtex® UltraScale™
Yüzey Montaj
YES
Ambalaj
Bulk
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED

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