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C3 ChipZentronix

Xilinx Inc.

XCV812E-8BG560C

FPGAs

RoHS: Compliant

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Specifications

ECCN Kodu
3A991.D
Total Ram Bits
1146880
Besleme Gerilimi
1.71V~1.89V
Number Of Labsclbs
4704
Radyasyon Dayanımı
No
Uzunluk
42.5mm
Kurşunsuz
Contains Lead
Temel Parça No
XCV812E
RoHS Durumu
Non-RoHS Compliant
Yayın Yılı
2002
Tepe Reflow Süresi (maks. sn)
30
Ram Size
140kB
Operating Supply Voltage
1.8V
Terminal Formu
BALL
Nem Hassasiyeti (MSL)
3 (168 Hours)
Maks. Oturma Yüksekliği
1.7mm
Parça Durumu
Obsolete
Terminal Adımı
1.27mm
Terminal Pozisyonu
BOTTOM
Number Of Gates
254016
Tepe Reflow Sıcaklığı (°C)
225
Pin Sayısı
560
Combinatorial Delay Of A Clbmax
0.4 ns
Terminal Kaplaması
Tin/Lead (Sn63Pb37)
Çalışma Sıcaklığı
0°C~85°C TJ
Speed Grade
8
Terminal Sayısı
560
Number Of Outputs
404
Ambalaj
Tray
Clock Frequency
416MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Besleme Gerilimi
1.8V
Montaj
Surface Mount
Jesd30 Code
S-PBGA-B560
JESD-609 Kodu
e0
Number Of Inputs
404
Kurşunsuz Kodu
no
Genişlik
42.5mm
Number Of Logic Elementscells
21168
Kılıf / Paket
560-LBGA Exposed Pad, Metal

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