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XCV812E-6FG900C

Xilinx Inc.

XCV812E-6FG900C

FPGAs

RoHS: Compliant

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RoHS

Compliant

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Specifications

Radyasyon Dayanımı
No
Number Of Labsclbs
4704
Besleme Gerilimi
1.71V~1.89V
Total Ram Bits
1146880
ECCN Kodu
3A991.D
Tepe Reflow Süresi (maks. sn)
30
Ram Size
140kB
Yayın Yılı
2002
RoHS Durumu
Non-RoHS Compliant
Temel Parça No
XCV812E
Kurşunsuz
Contains Lead
Uzunluk
31mm
Tepe Reflow Sıcaklığı (°C)
225
Terminal Pozisyonu
BOTTOM
Number Of Gates
254016
Terminal Adımı
1mm
Parça Durumu
Obsolete
Nem Hassasiyeti (MSL)
3 (168 Hours)
Terminal Formu
BALL
Operating Supply Voltage
1.8V
Combinatorial Delay Of A Clbmax
0.47 ns
Pin Sayısı
900
Pin Sayısı
900
Ambalaj
Tray
Number Of Outputs
556
Speed Grade
6
HTS Kodu
8542.39.00.01
Terminal Sayısı
900
Çalışma Sıcaklığı
0°C~85°C TJ
Montaj
Surface Mount
Besleme Gerilimi
1.8V
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Clock Frequency
357MHz
Kurşunsuz Kodu
no
Genişlik
31mm
JESD-609 Kodu
e0
Montaj Tipi
Surface Mount
Number Of Ios
556
Seri
Virtex®-E EM
Kılıf / Paket
900-BBGA

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