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XCV600E-8FG676C

Xilinx Inc.

XCV600E-8FG676C

FPGAs

RoHS: Compliant

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RoHS

Compliant

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Specifications

Tepe Reflow Süresi (maks. sn)
30
Ram Size
36kB
Yayın Yılı
1999
RoHS Durumu
Non-RoHS Compliant
Uzunluk
27mm
Kurşunsuz
Contains Lead
Temel Parça No
XCV600E
Radyasyon Dayanımı
No
Number Of Labsclbs
3456
Besleme Gerilimi
1.71V~1.89V
ECCN Kodu
3A991.D
Total Ram Bits
294912
Combinatorial Delay Of A Clbmax
0.4 ns
Pin Sayısı
676
Pin Sayısı
676
Tepe Reflow Sıcaklığı (°C)
225
Number Of Gates
985882
Terminal Pozisyonu
BOTTOM
Maks. Oturma Yüksekliği
2.6mm
Nem Hassasiyeti (MSL)
3 (168 Hours)
Terminal Adımı
1mm
Parça Durumu
Obsolete
Operating Supply Voltage
1.8V
Terminal Formu
BALL
Montaj
Surface Mount
Besleme Gerilimi
1.8V
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Clock Frequency
416MHz
Ambalaj
Tray
Speed Grade
8
Terminal Sayısı
676
Number Of Outputs
444
Terminal Kaplaması
Tin/Lead (Sn63Pb37)
Çalışma Sıcaklığı
0°C~85°C TJ
Number Of Ios
444
Montaj Tipi
Surface Mount
Seri
Virtex®-E
Number Of Logic Elementscells
15552
Kılıf / Paket
676-BBGA, FCBGA
Kurşunsuz Kodu
no

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