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C3 ChipZentronix

Xilinx Inc.

XCV200E-8BG352C

FPGAs

RoHS: Compliant

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RoHS

Compliant

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Specifications

Ram Size
14kB
JESD-609 Kodu
e0
ECCN Kodu
3A991.D
Tepe Reflow Sıcaklığı (°C)
225
Number Of Outputs
260
Number Of Gates
306393
Number Of Labsclbs
1176
RoHS Durumu
Non-RoHS Compliant
Uzunluk
35mm
Ambalaj
Tray
Speed Grade
8
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Kılıf / Paket
352-LBGA Exposed Pad, Metal
Maks. Oturma Yüksekliği
1.7mm
Kurşunsuz
Contains Lead
Operating Supply Voltage
1.8V
Radyasyon Dayanımı
No
Terminal Kaplaması
Tin/Lead (Sn63Pb37)
Terminal Adımı
1.27mm
Seri
Virtex®-E
Besleme Gerilimi
1.71V~1.89V
Montaj
Surface Mount
Yayın Yılı
2006
Terminal Pozisyonu
BOTTOM
Number Of Logic Elementscells
5292
Terminal Formu
BALL
Terminal Sayısı
352
Besleme Gerilimi
1.8V
Jesd30 Code
S-PBGA-B352
Kurşunsuz Kodu
no
Total Ram Bits
114688
Parça Durumu
Obsolete
Nem Hassasiyeti (MSL)
3 (168 Hours)
Tepe Reflow Süresi (maks. sn)
30
Combinatorial Delay Of A Clbmax
0.4 ns
Number Of Equivalent Gates
63504
Montaj Tipi
Surface Mount
Genişlik
35mm
Number Of Ios
260
Number Of Inputs
260

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