+90 533 300 32 01
C3 ChipZentronix

Xilinx Inc.

XCV200-4BG352I

FPGAs

RoHS: Compliant

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RoHS

Compliant

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Specifications

Maks. Oturma Yüksekliği
1.7mm
Kurşunsuz
Contains Lead
Operating Supply Voltage
2.5V
Kılıf / Paket
352-LBGA Exposed Pad, Metal
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Speed Grade
4
Ambalaj
Tray
Montaj
Surface Mount
Terminal Adımı
1.27mm
Seri
Virtex®
Besleme Gerilimi
2.375V~2.625V
Terminal Kaplaması
Tin/Lead (Sn63Pb37)
Radyasyon Dayanımı
No
Ram Size
7kB
JESD-609 Kodu
e0
Tepe Reflow Sıcaklığı (°C)
225
RoHS Durumu
Non-RoHS Compliant
Uzunluk
35mm
Number Of Labsclbs
1176
Number Of Gates
236666
Number Of Outputs
260
Number Of Ios
260
Genişlik
35mm
Montaj Tipi
Surface Mount
Clock Frequency
250MHz
Temel Parça No
XCV200
Pin Sayısı
352
Number Of Inputs
260
Çalışma Sıcaklığı
-40°C~100°C TJ
Terminal Sayısı
352
Besleme Gerilimi
2.5V
Terminal Formu
BALL
Number Of Logic Elementscells
5292
Terminal Pozisyonu
BOTTOM
Yayın Yılı
2000
Combinatorial Delay Of A Clbmax
0.8 ns
Nem Hassasiyeti (MSL)
3 (168 Hours)
Tepe Reflow Süresi (maks. sn)
30
Kurşunsuz Kodu
no
Total Ram Bits
57344

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