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C3 ChipZentronix

Xilinx Inc.

XCV1000-6BG560C

FPGAs

RoHS: Compliant

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RoHS

Compliant

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Specifications

JESD-609 Kodu
e0
Ambalaj
Tray
Combinatorial Delay Of A Clbmax
0.6 ns
Genişlik
42.5mm
ECCN Kodu
EAR99
Number Of Gates
1124022
Qualification Status
Not Qualified
Montaj
Surface Mount
Terminal Formu
BALL
RoHS Durumu
Non-RoHS Compliant
Ram Size
16kB
Tepe Reflow Süresi (maks. sn)
30
Uzunluk
42.5mm
Maks. Oturma Yüksekliği
1.7mm
Pin Sayısı
560
Number Of Ios
404
Number Of Logic Elementscells
27648
HTS Kodu
8542.39.00.01
Jesd30 Code
S-PBGA-B560
Seri
Virtex®
Terminal Sayısı
560
REACH Uyumluluk Kodu
not_compliant
Tepe Reflow Sıcaklığı (°C)
225
Çalışma Sıcaklığı
0°C~85°C TJ
Nem Hassasiyeti (MSL)
3 (168 Hours)
Total Ram Bits
131072
Parça Durumu
Obsolete
Kılıf / Paket
560-LBGA Exposed Pad, Metal
Power Supplies
1.2/3.62.5V
Terminal Adımı
1.27mm
Terminal Kaplaması
Tin/Lead (Sn63Pb37)
Besleme Gerilimi
2.5V
Kurşunsuz
Contains Lead
Montaj Tipi
Surface Mount
Number Of Inputs
404
Temel Parça No
XCV1000
Number Of Outputs
404
Besleme Gerilimi
2.375V~2.625V
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pozisyonu
BOTTOM

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