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C3 ChipZentronix
XCKU5P-2FFVB676E

Xilinx Inc.

XCKU5P-2FFVB676E

FPGAs

In StockRoHS: Compliant

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RoHS

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Specifications

Number Of Ios
280
Montaj Tipi
Surface Mount
RoHS Durumu
ROHS3 Compliant
Ram Size
2.1MB
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Çalışma Sıcaklığı
0°C~100°C TJ
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
JESD-609 Kodu
e1
Yayın Yılı
2012
HTS Kodu
8542.39.00.01
Ambalaj
Tray
Parça Durumu
Active
Seri
Kintex® UltraScale+™
Kılıf / Paket
676-BBGA, FCBGA
Terminal Kaplaması
Tin/Silver/Copper (Sn/Ag/Cu)
Nem Hassasiyeti (MSL)
4 (72 Hours)
Besleme Gerilimi
0.825V~0.876V
Number Of Labsclbs
27120
Total Ram Bits
41984000
Fabrika Tedarik Süresi
11 Weeks
Number Of Logic Elementscells
474600
Kurşunsuz Kodu
yes
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY

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