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C3 ChipZentronix
XCKU060-3FFVA1156E

Xilinx Inc.

XCKU060-3FFVA1156E

FPGAs

RoHS: Compliant

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RoHS

Compliant

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Specifications

Memory Types
RAM
Fabrika Tedarik Süresi
10 Weeks
Max Junction Temperature Tj
100°C
Montaj Tipi
Surface Mount
Ram Size
4.8MB
Number Of Logic Elementscells
725550
Number Of Labsclbs
41460
Parça Durumu
Active
Yükseklik
3.51mm
Total Ram Bits
38912000
Packing Method
TRAY
Çalışma Sıcaklığı
0°C~100°C TJ
Qualification Status
Not Qualified
Terminal Pozisyonu
BOTTOM
JESD-609 Kodu
e1
Besleme Gerilimi
0.970V~1.030V
Nem Hassasiyeti (MSL)
4 (72 Hours)
Number Of Clbs
2760
Yayın Yılı
2012
Number Of Ios
520
Number Of Outputs
520
Jesd30 Code
S-PBGA-B1156
Power Supplies
1V
Number Of Inputs
520
Yüzey Montaj
YES
Speed Grade
3
Terminal Formu
BALL
Kılıf / Paket
1156-BBGA, FCBGA
Besleme Gerilimi
1V
Ambalaj
Bulk
Seri
Kintex® UltraScale™
Organization
2760 CLBS
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Terminal Kaplaması
Tin/Silver/Copper (Sn/Ag/Cu)
RoHS Durumu
ROHS3 Compliant

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