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C3 ChipZentronix
XC7Z045-1FBG676C

Xilinx Inc.

XC7Z045-1FBG676C

SoC

In StockRoHS: Compliant

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Genuine parts

Verified sourcing

RoHS

Compliant

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Technical team support

Specifications

Tepe Reflow Süresi (maks. sn)
30
Contact Plating
Copper, Silver, Tin
Temel Parça No
XC7Z045
Min Supply Voltage
1.2V
Ram Size
256KB
Data Bus Width
32b
Primary Attributes
Kintex™-7 FPGA, 350K Logic Cells
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Boundary Scan
YES
ECCN Kodu
3A991.D
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
HTS Kodu
8542.39.00.01
Pin Sayısı
676
RoHS Durumu
ROHS3 Compliant
Ambalaj
Tray
Ram Words
256000
Speed Grade
-1
Number Of Ios
130
Terminal Formu
BALL
Terminal Kaplaması
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Besleme Gerilimi
1V
Frekans
667MHz
Core Architecture
ARM
Terminal Adımı
1mm
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Yayın Yılı
2009
Çalışma Sıcaklığı
0°C~85°C TJ
Tepe Reflow Sıcaklığı (°C)
245
Radyasyon Dayanımı
No
Nem Hassasiyeti (MSL)
3 (168 Hours)
Kılıf / Paket
676-BBGA, FCBGA
JESD-609 Kodu
e1
Memory Types
ROMless
Maks. Oturma Yüksekliği
2.54mm
Yüzey Montaj
YES
Max Supply Voltage
3.3V
Parça Durumu
Active
Fabrika Tedarik Süresi
10 Weeks
Number Of Logic Elementscells
190000

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