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C3 ChipZentronix
XC7Z035-2FBG676I

Xilinx Inc.

XC7Z035-2FBG676I

SoC

In StockRoHS: Compliant

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Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Peripherals
DMA
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Yayın Yılı
2010
Terminal Adımı
1mm
Number Of Registers
343800
Çalışma Sıcaklığı
-40°C~100°C TJ
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
JESD-609 Kodu
e1
Nem Hassasiyeti (MSL)
4 (72 Hours)
Kılıf / Paket
676-BBGA, FCBGA
Jesd30 Code
S-PBGA-B676
Parça Durumu
Active
Max Supply Voltage
1.05V
Fabrika Tedarik Süresi
10 Weeks
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Seri
Zynq®-7000
Terminal Sayısı
676
Terminal Pozisyonu
BOTTOM
Architecture
MCU, FPGA
Montaj
Surface Mount
Contact Plating
Copper, Silver, Tin
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Ram Size
256KB
Min Supply Voltage
950mV
Primary Attributes
Kintex™-7 FPGA, 275K Logic Cells
Propagation Delay
100 ps
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Boundary Scan
YES
ECCN Kodu
3A991.D
RoHS Durumu
ROHS3 Compliant
Speed Grade
2
Ambalaj
Tray
Number Of Ios
130
Terminal Formu
BALL
Core Architecture
ARM
Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Terminal Kaplaması
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Besleme Gerilimi
1V
Frekans
800MHz

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