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C3 ChipZentronix
XC7Z035-2FBG676E

Xilinx Inc.

XC7Z035-2FBG676E

SoC

In StockRoHS: Compliant

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Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Yüzey Montaj
YES
Parça Durumu
Active
Fabrika Tedarik Süresi
10 Weeks
Genişlik
27mm
Supply Voltagemax Vsup
1.05V
Terminal Pozisyonu
BOTTOM
Uzunluk
27mm
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Seri
Zynq®-7000
Terminal Sayısı
676
Architecture
MCU, FPGA
Terminal Adımı
1mm
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Yayın Yılı
2010
Çalışma Sıcaklığı
0°C~100°C TJ
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Nem Hassasiyeti (MSL)
3 (168 Hours)
Kılıf / Paket
676-BBGA, FCBGA
JESD-609 Kodu
e1
Supply Voltagemin Vsup
0.95V
Maks. Oturma Yüksekliği
2.54mm
Jesd30 Code
S-PBGA-B676
RoHS Durumu
ROHS3 Compliant
Ambalaj
Tray
Ram Words
256000
Number Of Ios
130
Terminal Formu
BALL
Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Frekans
800MHz
Besleme Gerilimi
1V
Terminal Kaplaması
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Core Architecture
ARM
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Ram Size
256KB
Primary Attributes
Kintex™-7 FPGA, 275K Logic Cells
Boundary Scan
YES
ECCN Kodu
3A991.D
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB

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