Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- RoHS Durumu
- ROHS3 Compliant
- Ambalaj
- Tray
- Speed Grade
- 1
- Ram Words
- 256000
- Number Of Ios
- 130
- Terminal Formu
- BALL
- Besleme Gerilimi
- 1V
- Terminal Kaplaması
- Tin/Silver/Copper (Sn/Ag/Cu)
- Frekans
- 667MHz
- Core Architecture
- ARM
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Montaj
- Surface Mount
- Contact Plating
- Copper, Silver, Tin
- Min Supply Voltage
- 950mV
- Ram Size
- 256KB
- Propagation Delay
- 120 ps
- Primary Attributes
- Kintex™-7 FPGA, 275K Logic Cells
- Boundary Scan
- YES
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Bus Compatibility
- CAN; ETHERNET; I2C; SPI; UART; USB
- Max Supply Voltage
- 1.05V
- Parça Durumu
- Active
- Fabrika Tedarik Süresi
- 10 Weeks
- Genişlik
- 27mm
- Terminal Pozisyonu
- BOTTOM
- Uzunluk
- 27mm
- Interface
- CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Terminal Sayısı
- 676
- Seri
- Zynq®-7000
- Architecture
- MCU, FPGA
- Core Processor
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Peripherals
- DMA
- Yayın Yılı
- 2010
- Çalışma Sıcaklığı
- -40°C~100°C TJ
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Number Of Registers
- 343800
- Nem Hassasiyeti (MSL)
- 4 (72 Hours)
- Kılıf / Paket
- 676-BBGA, FCBGA
- JESD-609 Kodu
- e1
- Maks. Oturma Yüksekliği
- 3.37mm