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C3 ChipZentronix
XC7Z030-L2FBG676I

Xilinx Inc.

XC7Z030-L2FBG676I

SoC

In StockRoHS: Compliant

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Verified sourcing

RoHS

Compliant

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Technical team support

Specifications

Min Supply Voltage
950mV
Ram Size
256KB
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Montaj
Surface Mount
Contact Plating
Copper, Silver, Tin
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Boundary Scan
YES
ECCN Kodu
3A991.D
HTS Kodu
8542.39.00.01
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Ambalaj
Tray
Ram Words
256000
RoHS Durumu
ROHS3 Compliant
Additional Feature
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Frekans
800MHz
Besleme Gerilimi
1V
Terminal Kaplaması
Tin/Silver/Copper (Sn/Ag/Cu)
Core Architecture
ARM
Terminal Formu
BALL
Number Of Ios
130
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Çalışma Sıcaklığı
-40°C~100°C TJ
Number Of Registers
157200
Terminal Adımı
1mm
Peripherals
DMA
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Yayın Yılı
2010
Maks. Oturma Yüksekliği
2.54mm
Jesd30 Code
S-PBGA-B676
Nem Hassasiyeti (MSL)
3 (168 Hours)
Kılıf / Paket
676-BBGA, FCBGA
JESD-609 Kodu
e1
Fabrika Tedarik Süresi
10 Weeks
Genişlik
27mm
Max Supply Voltage
1.05V
Parça Durumu
Active
Architecture
MCU, FPGA
Terminal Pozisyonu
BOTTOM
Uzunluk
27mm

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