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C3 ChipZentronix
XC7Z030-3FBG676E

Xilinx Inc.

XC7Z030-3FBG676E

SoC

In StockRoHS: Compliant

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Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Speed Grade
-3
Ram Words
256000
Ambalaj
Tray
RoHS Durumu
ROHS3 Compliant
Pin Sayısı
676
Core Architecture
ARM
Frekans
1GHz
Terminal Kaplaması
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Besleme Gerilimi
1V
Operating Supply Voltage
1V
Terminal Formu
BALL
Number Of Ios
130
Ram Size
256KB
Temel Parça No
XC7Z030
Contact Plating
Copper, Silver, Tin
Tepe Reflow Süresi (maks. sn)
30
HTS Kodu
8542.39.00.01
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Boundary Scan
YES
ECCN Kodu
3A991.D
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Data Bus Width
32b
Supply Voltagemax Vsup
1.05V
Fabrika Tedarik Süresi
10 Weeks
Parça Durumu
Active
Yüzey Montaj
YES
Architecture
MCU, FPGA
Seri
Zynq®-7000
Terminal Sayısı
676
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Uzunluk
27mm
Terminal Pozisyonu
BOTTOM
Tepe Reflow Sıcaklığı (°C)
245
Çalışma Sıcaklığı
0°C~100°C TJ
Yayın Yılı
2009
Peripherals
DMA
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Terminal Adımı
1mm
Maks. Oturma Yüksekliği
2.54mm

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