Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Montaj
- Surface Mount
- Upsucsperipheral Ics Type
- MICROPROCESSOR CIRCUIT
- Contact Plating
- Copper, Silver, Tin
- Ram Size
- 256KB
- Data Bus Width
- 32b
- Primary Attributes
- Kintex™-7 FPGA, 125K Logic Cells
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Boundary Scan
- YES
- ECCN Kodu
- EAR99
- HTS Kodu
- 8542.39.00.01
- Bus Compatibility
- CAN; ETHERNET; I2C; SPI; UART; USB
- Pin Sayısı
- 485
- RoHS Durumu
- ROHS3 Compliant
- Ambalaj
- Tray
- Ram Words
- 256000
- Terminal Formu
- BALL
- Number Of Ios
- 130
- Power Supplies
- 11.8V
- Additional Feature
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
- Frekans
- 800MHz
- Besleme Gerilimi
- 1V
- Uv Erasable
- N
- Terminal Kaplaması
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Core Architecture
- ARM
- Qualification Status
- Not Qualified
- Terminal Adımı
- 0.8mm
- Peripherals
- DMA
- Core Processor
- Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Yayın Yılı
- 2009
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Çalışma Sıcaklığı
- 0°C~100°C TJ
- Nem Hassasiyeti (MSL)
- 4 (72 Hours)
- Kılıf / Paket
- 484-FBGA, FCBGA
- JESD-609 Kodu
- e1
- Maks. Oturma Yüksekliği
- 2.44mm
- Supply Voltagemin Vsup
- 0.95V
- Parça Durumu
- Active
- Fabrika Tedarik Süresi
- 10 Weeks
- Supply Voltagemax Vsup
- 1.05V