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C3 ChipZentronix
XC7Z030-1FBG676C

Xilinx Inc.

XC7Z030-1FBG676C

SoC

In StockRoHS: Compliant

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Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

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Technical team support

Specifications

Operating Supply Voltage
1V
Number Of Ios
130
Terminal Formu
BALL
Frekans
667MHz
Terminal Kaplaması
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Besleme Gerilimi
1V
Core Architecture
ARM
Pin Sayısı
676
RoHS Durumu
ROHS3 Compliant
Ambalaj
Tray
Speed Grade
-1
Ram Words
256000
Data Bus Width
32b
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
HTS Kodu
8542.39.00.01
ECCN Kodu
3A991.D
Boundary Scan
YES
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Tepe Reflow Süresi (maks. sn)
30
Contact Plating
Copper, Silver, Tin
Temel Parça No
XC7Z030
Ram Size
256KB
Terminal Pozisyonu
BOTTOM
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Seri
Zynq®-7000
Terminal Sayısı
676
Uzunluk
27mm
Architecture
MCU, FPGA
Yüzey Montaj
YES
Parça Durumu
Active
Fabrika Tedarik Süresi
10 Weeks
Supply Voltagemax Vsup
1.05V
Kılıf / Paket
676-BBGA, FCBGA
Radyasyon Dayanımı
No
Nem Hassasiyeti (MSL)
4 (72 Hours)
JESD-609 Kodu
e1
Maks. Oturma Yüksekliği
2.54mm
Terminal Adımı
1mm
Yayın Yılı
2009

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