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XC17S30ASO20C

Xilinx Inc.

XC17S30ASO20C

Configuration Proms for FPGAs

RoHS: Compliant

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RoHS

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Specifications

Tepe Reflow Sıcaklığı (°C)
225
Memory Size
300kb
Nem Hassasiyeti (MSL)
1 (Unlimited)
RoHS Durumu
Non-RoHS Compliant
Ürün Durumu
Obsolete
Terminal Sayısı
20
Ambalaj
Tube
Io Type
COMMON
Radyasyon Dayanımı
No
Temel Ürün No
XC17S30
Pin Sayısı
20
Tedarikçi Cihaz Paketi
20-SOIC
Tepe Reflow Süresi (maks. sn)
30
Terminal Kaplaması
Tin/Lead (Sn85Pb15)
Terminal Formu
GULL WING
Montaj Tipi
Surface Mount
Temel Parça No
XC17S30
Terminal Adımı
1.27mm
Fonksiyon Sayısı
1
JESD-609 Kodu
e0
Parça Durumu
Obsolete
Çalışma Sıcaklığı
0°C~70°C
Kurşunsuz Kodu
no
Density
512 kb
Standby Currentmax
0.00005A
Pin Sayısı
20
Kurşunsuz
Contains Lead
Supply Voltagemax Vsup
3.6V
Programmable Type
OTP
Yüzey Montaj
YES
Memory Width
1
HTS Kodu
8542.32.00.71
Operating Supply Voltage
3.3V
Terminal Pozisyonu
DUAL
Memory Ic Type
CONFIGURATION MEMORY
Parallelserial
SERIAL
Besleme Gerilimi
3.3V
Uzunluk
12.8mm
Paket
Tube
Organization
336768X1

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