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XAZU3EG-L1SFVC784I

Xilinx Inc.

XAZU3EG-L1SFVC784I

SoC

In StockRoHS: Compliant

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RoHS

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Specifications

Speed
500MHz, 1.2GHz
Uzunluk
23mm
Tepe Reflow Süresi (maks. sn)
NOT SPECIFIED
Nem Hassasiyeti (MSL)
3 (168 Hours)
Çalışma Sıcaklığı
-40°C~100°C TJ
Fabrika Tedarik Süresi
11 Weeks
Architecture
MPU, FPGA
Ram Size
1.8MB
Terminal Adımı
0.8mm
Number Of Ios
128
Yüzey Montaj
YES
Maks. Oturma Yüksekliği
3.32mm
Terminal Pozisyonu
BOTTOM
Jesd30 Code
S-PBGA-B784
Besleme Gerilimi
0.72V
HTS Kodu
8542.31.00.01
Peripherals
DMA, WDT
Ambalaj
Tray
Tepe Reflow Sıcaklığı (°C)
NOT SPECIFIED
Genişlik
23mm
Upsucsperipheral Ics Type
MICROPROCESSOR CIRCUIT
Kılıf / Paket
784-BFBGA, FCBGA
RoHS Durumu
ROHS3 Compliant
Terminal Formu
BALL
Terminal Sayısı
784
Parça Durumu
Active
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Seri
Zynq® UltraScale+™ MPSoC EG
Connectivity
CANbus, I2C, SPI, UART/USART, USB
Primary Attributes
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

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