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C3 ChipZentronix

Xilinx

XQZU55DR-L2FFRE1156I

SoC

In StockRoHS: Compliant

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Compliant

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Specifications

Body Orientation
Straight
Fabrika Paket Adedi
1
Termination Method
Solder Lug
Basehousing Material
Thermoplastic
Wire Size
22 to 12, 22 AWG
Çalışma Sıcaklığı
-40 to 105 °C
Pitch
11.1000 mm
Contact Plating
Zinc
Product Length
24.89 mm
Contact Materials
Steel
Mounting
Panel Mount
Housing Color
Black

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