XQ7Z100-1RF900I

Specifications

Uzunluk

31 mm

Genişlik

31 mm

Terminal Pozisyonu

BOTTOM

Package Description

BGA,

Yüzey Montaj

YES

Number Of Terminals

900

Package Code

BGA

Jesd30 Code

S-PBGA-B900

Rohs Code

No

REACH Uyumluluk Kodu

compliant

Operating Temperaturemin

-40 °C

Terminal Adımı

1 mm

Reflow Temperaturemax S

NOT SPECIFIED

Seated Heightmax

3.44 mm

Package Body Material

PLASTIC/EPOXY

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Temperature Grade

INDUSTRIAL

Part Life Cycle Code

Active

Ihs Manufacturer

XILINX INC

Üretici Parça No

XQ7Z100-1RF900I

Operating Temperaturemax

100 °C

Risk Rank

5.69

Terminal Formu

BALL

Package Style

GRID ARRAY

Package Shape

SQUARE

Upsucsperipheral Ics Type

MICROPROCESSOR CIRCUIT