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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Maks. Oturma Yüksekliği
- 0.014 (0.35mm)
- Paket
- Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
- Risk Rank
- 5.67
- Operating Temperaturemax
- 100 °C
- Seri
- CRCW-C
- Upsucsperipheral Ics Type
- MICROPROCESSOR CIRCUIT
- Package Shape
- SQUARE
- Package Style
- GRID ARRAY
- Terminal Formu
- BALL
- Direnç
- 8.2 Ohms
- Seated Heightmax
- 3.35 mm
- Üretici Parça No
- XQ7Z030-2RB484I
- Ihs Manufacturer
- XILINX INC
- Part Life Cycle Code
- Active
- Ürün Durumu
- Active
- Rohs Code
- No
- Package Code
- BGA
- Boyut / Ölçü
- 0.039 L x 0.020 W (1.00mm x 0.50mm)
- Technology
- CMOS
- Genişlik
- 23 mm
- Uzunluk
- 23 mm
- Güç (Watt)
- 0.063W, 1/16W
- Tolerans
- ±1%
- Terminal Sayısı
- 2
- Number Of Terminals
- 484
- Yüzey Montaj
- YES
- Package Description
- BGA, BGA484,22X22,40
- Composition
- Thick Film
- HTS Kodu
- 8542.39.00.01
- Package Equivalence Code
- BGA484,22X22,40
- Tedarikçi Cihaz Paketi
- 0402
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Uv Erasable
- N
- Package Body Material
- PLASTIC/EPOXY
- Reflow Temperaturemax S
- NOT SPECIFIED
- Temperature Grade
- INDUSTRIAL
- ECCN Kodu
- EAR99
- Jesd30 Code
- S-PBGA-B484
- Terminal Adımı
- 1 mm
- Operating Temperaturemin
- -40 °C