Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Body Material
- PLASTIC/EPOXY
- Seated Heightmax
- 3.35 mm
- Reflow Temperaturemax S
- NOT SPECIFIED
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Uv Erasable
- N
- Part Life Cycle Code
- Active
- Temperature Grade
- AUTOMOTIVE
- ECCN Kodu
- EAR99
- Üretici Parça No
- XQ7Z030-1RB484Q
- Ihs Manufacturer
- XILINX INC
- HTS Kodu
- 8542.39.00.01
- Risk Rank
- 5.67
- JESD-609 Kodu
- e0
- Operating Temperaturemax
- 125 °C
- Package Style
- GRID ARRAY
- Package Equivalence Code
- BGA484,22X22,40
- Terminal Formu
- BALL
- Upsucsperipheral Ics Type
- MICROPROCESSOR CIRCUIT
- Package Shape
- SQUARE
- Uzunluk
- 23 mm
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Terminal Pozisyonu
- BOTTOM
- Genişlik
- 23 mm
- Package Description
- FBGA-484
- Moisture Sensitivity Levels
- 4
- Number Of Terminals
- 484
- Yüzey Montaj
- YES
- Package Code
- BGA
- Rohs Code
- No
- Jesd30 Code
- S-PBGA-B484
- Qualification Status
- Not Qualified
- REACH Uyumluluk Kodu
- not_compliant
- Power Supplies
- 1,1.8 V
- Terminal Adımı
- 1 mm
- Operating Temperaturemin
- -40 °C
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