XCZU6CG-L1FBVB900I

Specifications

Package Shape

SQUARE

Yüzey Montaj

YES

Genişlik

31 mm

Jesd30 Code

S-PBGA-B900

Supply Voltagemax

0.742 V

Temperature Grade

INDUSTRIAL

Bus Compatibility

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

Üretici Parça No

XCZU6CG-L1FBVB900I

Upsucsperipheral Ics Type

MICROPROCESSOR CIRCUIT

Part Life Cycle Code

Active

Operating Temperaturemax

100 °C

Package Description

BGA, BGA900,30X30,40

Risk Rank

5.61

Terminal Formu

BALL

Number Of Terminals

900

Ihs Manufacturer

XILINX INC

Uzunluk

31 mm

Operating Temperaturemin

-40 °C

Package Code

BGA

Seated Heightmax

2.88 mm

Package Equivalence Code

BGA900,30X30,40

Terminal Adımı

1 mm

REACH Uyumluluk Kodu

unknown

Package Style

GRID ARRAY

Rohs Code

Yes

Supply Voltagenom

0.72 V

Supply Voltagemin

0.698 V

Terminal Pozisyonu

BOTTOM

Additional Feature

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

Package Body Material

PLASTIC/EPOXY