Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Paket
- Tray
- Peripherals
- DMA, WDT
- Connectivity
- CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Data Ram Size
- 256 kB
- Minimum Operating Temperature
- - 40 C
- Distributed Ram
- 1.8 Mb
- Ram Size
- 256KB
- L1 Cache Data Memory
- 2 x 32 kB, 2 x 32 kB
- Maks. Çalışma Sıcaklığı
- + 100 C
- Tedarikçi Cihaz Paketi
- 530-FCBGA (16x9.5)
- Core Processor
- Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Çalışma Sıcaklığı
- -40°C ~ 100°C (TJ)
- Montaj Stili
- SMD/SMT
- Core
- ARM Cortex A53, ARM Cortex R5F
- Speed
- 500MHz, 1.2GHz
- Architecture
- MPU, FPGA
- Operating Supply Voltage
- 850 mV
- Kılıf / Paket
- FBGA-530
- Fabrika Paket Adedi
- 1
- L1 Cache Instruction Memory
- 2 x 32 kB, 2 x 32 kB
- Number Of Ios
- 82 I/O
- Number Of Logic Elements
- 154350 LE
- Number Of Logic Array Blocks Labs
- 8820 LAB
- Seri
- Zynq® UltraScale+™ MPSoC CG
- Ürün Durumu
- Active
- Number Of Cores
- 4 Core
- Primary Attributes
- Zynq®UltraScale+™ FPGA, 154K+ Logic Cells