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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Body Material
- PLASTIC/EPOXY
- JESD-609 Kodu
- e1
- Terminal Pozisyonu
- BOTTOM
- Supply Voltagemin
- 0.825 V
- Supply Voltagenom
- 0.85 V
- Rohs Code
- Yes
- REACH Uyumluluk Kodu
- compliant
- Package Style
- GRID ARRAY
- Package Code
- BGA
- Reflow Temperaturemax S
- NOT SPECIFIED
- Ihs Manufacturer
- XILINX INC
- Number Of Terminals
- 1156
- Parça Durumu
- Active
- Terminal Formu
- BALL
- HTS Kodu
- 8542.31.00.01
- Seri
- *
- Ambalaj
- Tray
- Risk Rank
- 5.61
- Package Description
- FCBGA-1156
- Operating Temperaturemax
- 100 °C
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Part Life Cycle Code
- Active
- Terminal Kaplaması
- Tin/Silver/Copper (Sn/Ag/Cu)
- Moisture Sensitivity Levels
- 4
- Upsucsperipheral Ics Type
- MICROPROCESSOR CIRCUIT
- Üretici Parça No
- XCZU28DR-2FFVE1156E
- Temperature Grade
- OTHER
- Supply Voltagemax
- 0.876 V
- Jesd30 Code
- R-PBGA-B1156
- Yüzey Montaj
- YES
- Package Shape
- RECTANGULAR
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