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C3 ChipZentronix

Xilinx

XCV1600E-8FG900I

FPGA Evaluation Boards

RoHS: Compliant

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Specifications

Kurşunsuz Kodu
No
Package Style
GRID ARRAY
Jesd30 Code
S-PBGA-B900
Combinatorial Delay Of A Clbmax
0.4 ns
REACH Uyumluluk Kodu
not_compliant
Moisture Sensitivity Levels
3
Terminal Pozisyonu
BOTTOM
Terminal Formu
BALL
Part Package Code
BGA
Üretici Parça No
XCV1600E-8FG900I
Pin Sayısı
900
Number Of Inputs
700
Number Of Terminals
900
Power Supplies
1.2/3.6,1.8 V
Number Of Logic Cells
34992
Package Equivalence Code
BGA900,30X30,40
Number Of Equivalent Gates
419904
Package Shape
SQUARE
Ihs Manufacturer
XILINX INC
Package Code
BGA
Organization
7776 CLBS, 419904 GATES
Genişlik
31 mm
Package Description
FBGA-900
Number Of Outputs
700
Yüzey Montaj
YES
Uzunluk
31 mm
Supply Voltagemax
1.89 V
Tepe Reflow Sıcaklığı (°C)
225
JESD-609 Kodu
e0
Supply Voltagenom
1.8 V
Seated Heightmax
2.6 mm
Terminal Kaplaması
Tin/Lead (Sn63Pb37)
Clock Frequencymax
416 MHz
Terminal Adımı
1 mm
Reflow Temperaturemax S
30
Qualification Status
Not Qualified
Risk Rank
5.84
Package Body Material
PLASTIC/EPOXY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Supply Voltagemin
1.71 V

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