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C3 ChipZentronix

Xilinx

XCV1000E-8BGG560I

FPGA Evaluation Boards

In StockRoHS: Compliant

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Specifications

Jesd30 Code
S-PBGA-B560
Package Style
GRID ARRAY, LOW PROFILE
Kurşunsuz Kodu
Yes
Combinatorial Delay Of A Clbmax
0.4 ns
Terminal Pozisyonu
BOTTOM
REACH Uyumluluk Kodu
compliant
Moisture Sensitivity Levels
3
Terminal Formu
BALL
Number Of Terminals
560
Number Of Inputs
404
Number Of Logic Cells
27648
Power Supplies
1.2/3.6,1.8 V
Part Package Code
BGA
Üretici Parça No
XCV1000E-8BGG560I
Pin Sayısı
560
Package Equivalence Code
BGA560,33X33,50
Package Shape
SQUARE
Number Of Equivalent Gates
331776
Package Description
LBGA, BGA560,33X33,50
Ihs Manufacturer
XILINX INC
Package Code
LBGA
Genişlik
42.5 mm
Organization
6144 CLBS, 331776 GATES
Yüzey Montaj
YES
Number Of Outputs
404
Uzunluk
42.5 mm
Supply Voltagemax
1.89 V
Supply Voltagenom
1.8 V
JESD-609 Kodu
e1
Tepe Reflow Sıcaklığı (°C)
260
Seated Heightmax
1.7 mm
Clock Frequencymax
416 MHz
Terminal Kaplaması
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Adımı
1.27 mm
Reflow Temperaturemax S
30
Qualification Status
Not Qualified
Risk Rank
5.8
Package Body Material
PLASTIC/EPOXY
Part Life Cycle Code
Obsolete
Rohs Code
Yes

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