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Xilinx

XCR3064XL-6CP56I

FPGA Evaluation Boards

In StockRoHS: Compliant

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RoHS

Compliant

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Specifications

Package Body Material
PLASTIC/EPOXY
Part Package Code
BGA
Reflow Temperaturemax S
30
Propagation Delay
6 ns
Temperature Grade
INDUSTRIAL
Risk Rank
5.15
Clock Frequencymax
167 MHz
Uzunluk
6 mm
Terminal Pozisyonu
BOTTOM
Yüzey Montaj
YES
Programmable Logic Type
EE PLD
Pin Sayısı
56
Kurşunsuz Kodu
No
Organization
44 I/O
Package Description
LFBGA,
Number Of Terminals
56
Operating Temperaturemin
-40 °C
HTS Kodu
8542.39.00.01
Qualification Status
Not Qualified
Terminal Formu
BALL
Moisture Sensitivity Levels
3
Package Code
LFBGA
Supply Voltagemin
2.7 V
JESD-609 Kodu
e0
Üretici Parça No
XCR3064XL-6CP56I
Part Life Cycle Code
Active
Terminal Kaplaması
TIN LEAD
Output Function
MACROCELL
Genişlik
6 mm
Operating Temperaturemax
85 °C
Rohs Code
No
Supply Voltagenom
3.3 V
Supply Voltagemax
3.6 V
Jesd30 Code
S-PBGA-B56
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Terminal Adımı
0.5 mm
Seated Heightmax
1.35 mm
Package Shape
SQUARE
Ihs Manufacturer
XILINX INC
Number Of Io Lines
44

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