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Xilinx

XC6VSX475T-3FFG1759C

FPGA Evaluation Boards

In StockRoHS: Compliant

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RoHS

Compliant

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Specifications

Tepe Reflow Sıcaklığı (°C)
245
Moisture Sensitivity Levels
4
Yüzey Montaj
YES
Package Style
GRID ARRAY
Risk Rank
5.27
Package Description
42.50 X 42.50 MM, LEAD FREE, FBGA-1759
Terminal Kaplaması
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Temperature Grade
OTHER
Package Shape
SQUARE
Seated Heightmax
3.5 mm
REACH Uyumluluk Kodu
not_compliant
Jesd30 Code
S-PBGA-B1759
Reflow Temperaturemax S
30
Ihs Manufacturer
XILINX INC
Üretici Parça No
XC6VSX475T-3FFG1759C
Supply Voltagenom
1 V
Terminal Adımı
1 mm
Genişlik
42.5 mm
Package Code
BGA
Rohs Code
Yes
Terminal Formu
BALL
Combinatorial Delay Of A Clbmax
0.59 ns
Operating Temperaturemax
85 °C
Supply Voltagemax
1.05 V
Organization
37200 CLBS
Part Life Cycle Code
Active
Terminal Pozisyonu
BOTTOM
Package Body Material
PLASTIC/EPOXY
Uzunluk
42.5 mm
Number Of Terminals
1759
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Kodu
e1
Number Of Clbs
37200
Supply Voltagemin
0.95 V

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