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Xilinx

XC5VLX50-3FF324I

FPGA Evaluation Boards

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Specifications

Package Body Material
PLASTIC/EPOXY
Package Shape
SQUARE
Üretici Parça No
XC5VLX50-3FF324I
Tepe Reflow Sıcaklığı (°C)
225
Ihs Manufacturer
XILINX INC
Jesd30 Code
S-PBGA-B324
Package Description
BGA, BGA324,18X18,40
Power Supplies
1,2.5 V
JESD-609 Kodu
e0
Yüzey Montaj
YES
Risk Rank
5.88
Rohs Code
No
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Kurşunsuz Kodu
No
REACH Uyumluluk Kodu
not_compliant
Terminal Formu
BALL
Clock Frequencymax
710 MHz
Package Equivalence Code
BGA324,18X18,40
Part Life Cycle Code
Active
Number Of Outputs
560
Reflow Temperaturemax S
30
Terminal Kaplaması
Tin/Lead (Sn63Pb37)
Number Of Logic Cells
3600
Package Code
BGA
Moisture Sensitivity Levels
4
Terminal Pozisyonu
BOTTOM
Package Style
GRID ARRAY
Terminal Adımı
1 mm
Number Of Inputs
560
Number Of Terminals
324

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