XC5VLX330-2FF1760I

Specifications

Seated Heightmax

3.5 mm

Reflow Temperaturemax S

30

Terminal Kaplaması

Tin/Lead (Sn63Pb37)

Pin Sayısı

1760

Number Of Clbs

25920

Combinatorial Delay Of A Clbmax

0.77 ns

Supply Voltagemax

1.05 V

Number Of Logic Cells

331776

Moisture Sensitivity Levels

4

Operating Temperaturemin

-40 °C

Package Code

BGA

Organization

25920 CLBS

Terminal Pozisyonu

BOTTOM

HTS Kodu

8542.39.00.01

Package Style

GRID ARRAY

Temperature Grade

INDUSTRIAL

Terminal Adımı

1 mm

Number Of Inputs

1200

Number Of Terminals

1760

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Üretici Parça No

XC5VLX330-2FF1760I

Tepe Reflow Sıcaklığı (°C)

225

Ihs Manufacturer

XILINX INC

Jesd30 Code

S-PBGA-B1760

Package Description

BGA, BGA1760,42X42,40

Supply Voltagemin

0.95 V

Power Supplies

1,2.5 V

JESD-609 Kodu

e0

Supply Voltagenom

1 V

Uzunluk

42.5 mm

Risk Rank

5.23

Yüzey Montaj

YES

Rohs Code

No

Qualification Status

Not Qualified

Programmable Logic Type

FPGA

Operating Temperaturemax

100 °C

Kurşunsuz Kodu

No

Part Package Code

BGA

REACH Uyumluluk Kodu

not_compliant