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C3 ChipZentronix

Xilinx

XC2VP100-7FFG1704I

FPGA Evaluation Boards

RoHS: Compliant

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RoHS

Compliant

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Specifications

Genişlik
42.5 mm
Yüzey Montaj
YES
Number Of Clbs
11024
Qualification Status
Not Qualified
JESD-609 Kodu
e1
Tepe Reflow Sıcaklığı (°C)
245
Package Description
1 MM PITCH, FLIP CHIP, FBGA-1704
Terminal Formu
BALL
Supply Voltagemin
1.425 V
Risk Rank
5.79
Seated Heightmax
3.45 mm
Üretici Parça No
XC2VP100-7FFG1704I
Terminal Pozisyonu
BOTTOM
Number Of Terminals
1704
Package Body Material
PLASTIC/EPOXY
Package Shape
SQUARE
Pin Sayısı
1704
Ihs Manufacturer
XILINX INC
Rohs Code
Yes
Terminal Adımı
1 mm
Clock Frequencymax
1350 MHz
Jesd30 Code
S-PBGA-B1704
Terminal Kaplaması
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Package Style
GRID ARRAY
Supply Voltagemax
1.575 V
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
REACH Uyumluluk Kodu
not_compliant
Package Code
BGA
Supply Voltagenom
1.5 V
Moisture Sensitivity Levels
4
Organization
11024 CLBS
Uzunluk
42.5 mm
Part Life Cycle Code
Obsolete
Kurşunsuz Kodu
Yes
Combinatorial Delay Of A Clbmax
0.28 ns
Part Package Code
BGA
Reflow Temperaturemax S
30

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