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C3 ChipZentronix

Xilinx

XC2V4000-6FFG1152I

FPGA Evaluation Boards

RoHS: Compliant

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Specifications

Jesd30 Code
S-PBGA-B1152
Terminal Kaplaması
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Supply Voltagenom
1.5 V
Organization
5760 CLBS, 4000000 GATES
Uzunluk
35 mm
Moisture Sensitivity Levels
4
Kurşunsuz Kodu
Yes
Part Life Cycle Code
Obsolete
Part Package Code
BGA
Combinatorial Delay Of A Clbmax
0.35 ns
Power Supplies
1.5,1.5/3.3,3.3 V
Reflow Temperaturemax S
30
Package Style
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Supply Voltagemax
1.575 V
REACH Uyumluluk Kodu
not_compliant
Package Code
BGA
Supply Voltagemin
1.425 V
Number Of Equivalent Gates
4000000
Terminal Formu
BALL
Package Description
35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152
Risk Rank
5.8
Number Of Logic Cells
51840
Üretici Parça No
XC2V4000-6FFG1152I
Seated Heightmax
3.4 mm
Terminal Pozisyonu
BOTTOM
HTS Kodu
8542.39.00.01
Genişlik
35 mm
Yüzey Montaj
YES
Number Of Clbs
5760
Qualification Status
Not Qualified
JESD-609 Kodu
e1
Tepe Reflow Sıcaklığı (°C)
245
Terminal Adımı
1 mm
Number Of Inputs
824
Clock Frequencymax
820 MHz
Package Equivalence Code
BGA1152,34X34,40
Number Of Outputs
824
Package Shape
SQUARE
Package Body Material
PLASTIC/EPOXY

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