XC2C64-5CP56C

Specifications

Part Life Cycle Code

Obsolete

Tepe Reflow Sıcaklığı (°C)

240

Package Code

LFBGA

JESD-609 Kodu

e0

Terminal Pozisyonu

BOTTOM

Terminal Kaplaması

Tin/Lead (Sn63Pb37)

ECCN Kodu

EAR99

Reflow Temperaturemax S

30

Part Package Code

BGA

Uzunluk

6 mm

Rohs Code

No

Package Shape

SQUARE

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Additional Feature

REAL DIGITAL DESIGN TECHNOLOGY

Üretici Parça No

XC2C64-5CP56C

Supply Voltagemax

1.9 V

Programmable Logic Type

FLASH PLD

Genişlik

6 mm

Package Description

6 X 6 MM, 0.50 MM PITCH, CSP-56

Ihs Manufacturer

XILINX INC

Number Of Io Lines

45

Jesd30 Code

S-PBGA-B56

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Organization

0 DEDICATED INPUTS, 45 I/O

REACH Uyumluluk Kodu

not_compliant

Pin Sayısı

56

Insystem Programmable

YES

Risk Rank

5.19

HTS Kodu

8542.39.00.01

Number Of Macro Cells

64

Output Function

MACROCELL

Terminal Adımı

0.5 mm

Package Equivalence Code

BGA56,10X10,20

Temperature Grade

COMMERCIAL

Propagation Delay

5 ns

Power Supplies

1.5/3.3,1.8 V

Supply Voltagenom

1.8 V

Terminal Formu

BALL

Seated Heightmax

1.35 mm