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C3 ChipZentronix

Xilinx

IS61QDB41M36-250M3LI

FPGA Evaluation Boards

In StockRoHS: Compliant

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Compliant

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Specifications

Risk Rank
5.66
Package Description
15 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-165
Part Life Cycle Code
Obsolete
Terminal Adımı
1 mm
Clock Frequencymax Fclk
250 MHz
Parallelserial
PARALLEL
Yüzey Montaj
YES
Package Code
LBGA
Terminal Kaplaması
TIN SILVER COPPER
Memory Ic Type
DDR SRAM
Supply Currentmax
0.5 mA
Number Of Terminals
165
Power Supplies
1.5/1.8,1.8 V
Additional Feature
PIPELINED ARCHITECTURE
Package Shape
RECTANGULAR
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
REACH Uyumluluk Kodu
compliant
Number Of Words
1048576 words
Operating Temperaturemin
-40 °C
Genişlik
15 mm
ECCN Kodu
3A991.B.2.A
Terminal Pozisyonu
BOTTOM
Io Type
SEPARATE
Uzunluk
17 mm
Rohs Code
Yes
Qualification Status
Not Qualified
Supply Voltagemin Vsup
1.71 V
Memory Density
37748736 bit
Tepe Reflow Sıcaklığı (°C)
260
Fonksiyon Sayısı
1
Operating Temperaturemax
85 °C
Terminal Formu
BALL
Number Of Words Code
1000000
HTS Kodu
8542.32.00.41
JESD-609 Kodu
e1
Supply Voltagemax Vsup
1.89 V
Package Equivalence Code
BGA165,11X15,40
Memory Width
36
Organization
1MX36
Access Timemax
0.38 ns

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