W29N01HZYINA

Specifications

Part Life Cycle Code

Active

Package Equivalence Code

BGA68(UNSPEC)

Yüzey Montaj

YES

REACH Uyumluluk Kodu

compliant

Data Retention Timemin

10

Parallelserial

PARALLEL

Package Description

,

Fonksiyon Sayısı

1

Memory Density

1073741824 bit

ECCN Kodu

EAR99

Supply Currentmax

0.035 mA

Supply Voltagenom Vsup

1.8 V

Memory Ic Type

FLASH

Rohs Code

Yes

Number Of Words

134217728 words

Tip

SLC NAND TYPE

Endurance

100000 Write/Erase Cycles

Jesd30 Code

R-XBCS-B68

Operating Mode

ASYNCHRONOUS

Terminal Pozisyonu

BOTTOM

Programming Voltage

1.8 V

Standby Currentmax

0.00005 A

Number Of Terminals

68

Package Code

WLCSP

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Seated Heightmax

0.54 mm

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Write Protection

HARDWARE

Supply Voltagemin Vsup

1.7 V

HTS Kodu

8542.32.00.51

Write Cycle Timemax Twc

0.025 ms

Memory Width

8

Number Of Words Code

128000000

Package Style

CHIP SCALE

Terminal Formu

BALL

Operating Temperaturemax

105 °C

Package Shape

RECTANGULAR

Supply Voltagemax Vsup

1.95 V

Operating Temperaturemin

-40 °C