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C3 ChipZentronix
W66CP2NQQAGJ

Winbond

W66CP2NQQAGJ

Memory Modules

RoHS: Compliant

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RoHS

Compliant

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Specifications

Frekans
3200/3733/4267MbpsMHz
Gerilim
1.06 ~ 1.17V
Io
32BIT
Density
4Gb
Dimensions
10X14.5mm2
Temperature
-40~105˚C
Interface Type
Low Power DDR4/4X SDRAM
Paket
TFBGA - 200

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