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C3 ChipZentronix
W638GU6QB09I

Winbond

W638GU6QB09I

Memory Modules

RoHS: Compliant

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RoHS

Compliant

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Specifications

Gerilim
1.283 ~ 1.45V
Io
16BIT
Temperature
-40 ~ 95˚C
Interface Type
DDR3 SDRAM
Dimensions
7.5X13mm2
Density
8Gb
Frekans
1866 / 2133 MbpsMHz

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