+90 533 300 32 01
Istanbul / Hong Kong
C3 ChipZentronix
W25N01GVZEIG

Winbond

W25N01GVZEIG

Specialized Modules

RoHS: Compliant

Request a quote for pricing

Priced by quantity and lead time.

Technical summary (PDF)

Shipping

Same-day dispatch from stock

Genuine parts

Verified sourcing

RoHS

Compliant

Support

Technical team support

Specifications

Density
1Gb
Paket
8-SON
Dtr
No
Temperature
-40~+85˚C
Interface Type
Serial (SPI, Dual SPI, Quad SPI)
Concurrent Operation
No
Ecc
On-Chip ECC
Dimensions
8X6mm2
Page Size
2KB+64B
Io
x1/x2/x4
Gerilim
2.7 ~ 3.6V
Frekans
104MHz
Default Read Mode
Buffer

Related Products

  • Phoenix Contact

    1051328

    Specialized Modules

  • Phoenix Contact

    1105099

    Specialized Modules

  • Phoenix Contact

    1105100

    Specialized Modules

  • Phoenix Contact

    1105101

    Specialized Modules

  • Phoenix Contact

    1105102

    Specialized Modules

  • Phoenix Contact

    1105103

    Specialized Modules

  • Phoenix Contact

    1105104

    Specialized Modules

  • Phoenix Contact

    1105105

    Specialized Modules

    • Fast Delivery

    Same-day prep and shipping from stock

    Genuine Parts

    Sourced from authorized channels

    Datasheet

    Technical documents for each part

    Technical Support

    Help before and after the sale